Hot Embosser

EVG 520HE

Microfluidics & lithography

Micro and nano fabrication

Glasses, metals and polymers

6 inch diameter wafers

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Thermally bond glass substrates and to emboss channel geometries into substrates

The EVG520HE hot embossing system (substrate bonder) is designed for bonding, embossing and nanoimprinting applications. It is capable of all wafer bonding processes such as thermo-compression, fusion or low temperature bonding. It is configured to allow hot embossing of polymers and even glass.

Hot embossing microfluidc devices or other features in polymers is a well accepted process and widely adopted. It's considered a robust process for the manufacture of polymer microfluidic devices.