EVG 620 with UV-NIL (nano-imprint lithography)
Microfluidics & lithography
Micro and nano fabrication
Ceramic, glasses, metal, polymers and semiconductor
6 inch diameter wafers
Transfer multilayer patterns into photoresist films down to nanometer scale
The EVG 620 Mask Aligner with UV-NIL (nano-imprint lithography) capability is a high resolution double side mask aligner with splitfield microscopes and it is capable of handling multiple wafer sizes with quick change-over time.
Menu driven software ensures repeatability over a number of different processes including aligned top and bottom features in substrates for the same device.