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Kloe Dilase

650 Direct Laser Write system

Lithography

Micro and nano fabrication

Non Material Specific

N/A

Scale:

Function:

Fabrication step:

Material:

Use:

For direct write rapid prototyping and mask fabrication

This equipment offers you the possibility to work with one or two writing lasers, to be focused into one to two beam sizes ranging from 1µm to 50 µm. It allows the writing on any type of substrate (photomasks, semiconductors, glass, polymers, crystals, flexible films...) over a surface area as large as 6x6 inches.

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For direct write rapid prototyping and mask fabrication. llows the writing on any type of substrate (photomasks, semiconductors, glass, polymers, crystals, flexible films...) over a surface area as large as 6x6 inches.

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