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Mask Aligner

EVG 620 with UV-NIL (nano-imprint lithography)

Microfluidics & lithography

Micro and nano fabrication

Ceramic, glasses, metal, polymers and semiconductor

6 inch diameter wafers



Fabrication step:



Transfer multilayer patterns into photoresist films down to nanometer scale

The EVG 620 Mask Aligner with UV-NIL (nano-imprint lithography) capability is a high resolution double side mask aligner with splitfield microscopes and it is capable of handling multiple wafer sizes with quick change-over time.

Menu driven software ensures repeatability over a number of different processes including aligned top and bottom features in substrates for the same device.

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