Microfluidics & deposition
Micro and nano fabrication
Metals (eg Au, Cr, Mo, Ti), TiO2, ITO
6 inch diameter
To deposit high quality (pinhole free) metal layers for the fabrication of UV lithography and DRI etch masks
The HHV/Edwards TF500 sputter coater is a front-loading deposition system with a chamber able to accommodate up to 6 inch diameter substrates. The system is fitted with three sputter sources with a switching system which allows users to select operation from DC or RF power supplies.
Multilayer deposition can be performed without breaking vacuum and the pumping system has a ceal room compatible dry pump with a turbo molecular pump.
Turbo molecular pump thickness monitor (QCM) with a rotating tilt stage