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Wafer Dicer

Disco DAD 321

Microfluidics, packaging and testing

Device fabrication, packaging and testing

Si wafer, Quartz & pyrex glass, plastics and metals



Fabrication step:



Cut substrates or final product to size

The Disco DAD 321 saw features versatile processing capabilities but maintains high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.

Substrates up to 6” diameter and 3 mm in thickness are mounted on dicing tape which has a sticky backing that holds the wafer on a thin sheet metal frame.

The dicing machine runs at high power (2.4KW), which makes this instrument capable of cutting hard and thick materials like bonded wafers up to 8 inches

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